NASA MSFC STD 2907:2006
NASA MSFC STD 2907:2006 Workmanship Standard For Printed Wiring Boards Sets forth requirements for rigid printed wiring boards (PWB's).
Table of Contents
DOCUMENTHISTORYLOGFOREWORD
1.0SCOPE
2.0APPLICABLEDOCUMENTS
3.0DEFINITIONS
4.0GENERALREQUIREMENTS
4.1Classification
4.2Qualification
4.3DeviationandWaiverRequests
4.4QualityManagementSystem
4.5Materials
4.5.1Metal-CladLaminates
4.5.2BondingLayer(Prepreg)
4.5.3PlatingorSolderCoating
4.5.4ElectrolessCopperPlating
4.5.5ElectrolyticCopperPlating
4.5.6Tin-LeadPlating
4.5.7SolderCoating
4.5.8GoldPlating
4.5.9NickelPlating
4.5.10SolderMask
4.5.11MarkingInk
4.5.12Solvents
4.6QualityConformanceTestCircuitry
4.6.1Type1andType2
4.6.2Type3
5.0DETAILEDREQUIREMENTS
5.1Dimensions
5.1.1HolePatterns
5.1.2Overall
5.2ConductorWidthandSpacing
5.3MeaslingandCrazing
5.4Delamination
5.5Undercutting
5.6ConductorOutgrowth
5.7BowandTwist
5.8PlatingAdhesion
5.9DielectricWithstandingVoltage
5.10Cleanliness
5.11Marking
5.12SolderMask
5.13SpecificRequirements
5.13.1PlatingorCoatingThickness
5.13.2AnnularRing
5.14SpecificRequirements
5.14.1Plated-ThroughHole
5.14.2HoleCleaningandEtchback(Type3Only)
5.14.3PlatingandCoatingThickness
5.14.4AnnularRing
5.14.5DielectricLayerThickness
5.14.6Layer-to-LayerRegistration
5.14.7ThermalStress
5.14.8HoleSolderability
5.14.9ReworkSolderability
5.14.10Circuitry(Type3Only)
5.14.11ThermalShock
5.15QualityAssuranceProvisions
5.15.1ResponsibilityforInspection
5.15.2TestEquipmentandInspectionFacilities
5.15.3ClassificationsofInspection
5.15.4MaterialsInspection
5.15.5SupplierQualificationInspection
5.15.6QualityConformanceInspection
5.15.7InspectionLot
5.15.8SamplingPlan
6.0NOTES